With the "Zen 3" x86 core architecture and innovative 6nm process technology, this series is characterized by excellent energy efficiency, among other things. Thanks to the latest Navi2 graphics architecture, up to 50% more CUs (compute units) with up to 2.4 GHz increased clock speed as well as more cache, the internal graphics achieves an unprecedented single-precision performance of up to approx. 3.5 Tflops.
The ultra-compact board - only about 10 x 10 cm in size - is an extremely powerful industrial embedded board with up to 8 cores and 16 threads depending on the CPU variant.
The high number of CPU cores and threads provides advantages especially for parallel applications. The SBC is ideal for applications that require high CPU and/or GPU performance as well as security features such as ECC & hardware TPM, for example 3D applications, augmented & virtual reality as well as AI systems, machine learning, IoT edge applications, industrial automation systems, computer vision and much more.
Key features of the PROFIVE® NUCS include a RAM of up to 64 GByte DualChannel DDR5 RAM with ECC (Error Correction Code) support, a wide range input from 10.8 VDC to 26.4 VDC, and numerous other safety features. These include the "AMD Firmware Trusted Platform Module" and a TPM 2.0 chip (Infineon) as well as health monitoring and management with adjustable fan control, hardware monitoring and watchdog.
Further specifications include fast 2.5 GBit Ethernet controllers, optional WiFi 6 support and various interfaces, for example two USB 3.1 Gen 2 ports, two Mini-Displayport++ and two USB-C-DP Alt Mode ports. Beyond that, multi-monitor applications with up to four 4K/60Hz monitors can be operated.
Keyfeatures
- powerful integrated GPU - AMD Radeon™ Graphics
- up to 64 GB DualChannel DDR5 memory with ECC support
- 2x Intel® I226 / 2.5 Gigabit Ethernet ports
- TSN support / Wake-on-LAN supported by one port
- 3x M.2 - Type B, Type E, Type M
- 2x SATA (6G) with separate power connector
- 2x USB-A 3.2 Gen2 (10 Gb/s, OCP = 1500 mA each)
- 2x USB-C port 3.2 Gen2 (10 Gb/s, OCP = 3000 mA each) or 2x USB-C
Alt Mode DP++, resolution up to 4096 x 2160 @ 60 Hz - 2x internal USB 2.0 (OCP = 900 mA each)
- 2x RS-232/485 ports (HDX/FDX)
- 2x Mini-DP++ connectors, resolution up to 4096 x 2160 @ 60 Hz
- fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon
SLB 9670) - min. 10,8 VDC to 26,4 VDC power supply range
- operating temperature range: commercial at 0 °C to +60 °C; others on request
- storage temperature range: from –40 °C to +85 °C
- max. rel. humidity: 95% @ 40 °C, non-condesing while stored | 89% while working
- size: approx. 102 mm x 102 mm
CPU types available
Different CPUs with a TDP of 15 W - 45 W are used:
AMD Ryzen™ PRO 6650U
6 cores / 12 threads – 2.9 GHz to 4.5 GHz – TDP: 15 W to 28 W
AMD Radeon™ Graphics
AMD Ryzen™ PRO 6850U
8 cores / 16 threads – 2.7 GHz to 4.7 GHz – TDP: 15 W to 28 W
AMD Radeon™ Graphics
AMD Ryzen™ PRO 6650H
6 cores / 12 threads – 3.3 GHz to 4.5 GHz – TDP: 45 W
AMD Radeon™ Graphics
AMD Ryzen™ PRO 6850H
8 cores / 16 threads – 3.2 GHz to 4.7 GHz – TDP: 45 W
AMD Radeon™ Graphics
AMD Ryzen™ PRO 6950H
8 cores / 16 threads – 3.3 GHz to 4.9 GHz – TDP: 45 W
AMD Radeon™ Graphics
Downloads
The advantage: Equipped with a compact active cooling solution
this single-board computer can be integrated immediately and is ready for use.
Differences to the basic board
active cooling solution included
size: approx. 113 mm x 46 mm x 109 mm
weight: approx. 330 g + options
size: approx. 102 mm x 102 mm
including mounted heatspreader
The advantage: The heatspreader, which also serves as a mounting plate, distributes the CPU heat to a larger cooling solution in the user's application. The mounting plate is compatible within the E.E.P.D. "easy to integrate" solutions, making it very easy to scale between performance classes. On the service side, this solution also brings great advantages, including fast replacement.
Differences to the basic board
mounted heatspreader included
size: approx. 111 mm x 31 mm x 103 mm
weight: approx. 250 g + options
size: approx. 102 mm x 102 mm
BoxPC with passive cooling
The advantage: The system is low-maintenance thanks to the silent & fanless passive cooling and is suitable for 24/7 continuous operation due to its robust design and the high-quality components built in. The compact dimensions allow installation in numerous applications. Thanks to the closed design, the systems can also be used in harsh environments.
Differences to the basic board
with integrated active cooling solution
The advantage: The SBC is equipped with an active cooling solution and is easy to integrate and mount in open-frame format. A lid is optionally available as an accessory.
Differences to the basic board
active cooling solution in open-frame format included
lid is optionally available as an accessory
size: approx. 139 mm x 86 mm x 110 mm
weight: approx. 890 g + options
size: approx. 102 mm x 102 mm
the ultra power tower - PRO IT mini workstation
The advantage: The compact MicroTower EM PRO midi is perfect as a portable workstation, mini server, IoT edge device / NAS server / web server, powerful business PC and workstation computer thanks to its very compact dimensions, low power consumption and high CPU and GPU performance.
Differences to the basic board
suitable for continuous operation (24/7)
sturdy housing made of brushed aluminium, black anodized
size: approx. 111 x 117 x 201 mm
weight: approx. 1.750 g + options
size: approx. 102 mm x 102 mm
waterproof BoxPC with passive cooling
The advantage: The system is low-maintenance thanks to the silent & fanless passive cooling and is suitable for 24/7 continuous operation due to its robust design and the high-quality components built in. The compact dimensions allow installation in numerous applications. Thanks to the closed design, the systems can also be used in harsh environments.