Advantages

24/7 - suitable for continuous operation
Ultra compact - based on embedded NUC™
Developed and manufactured in Germany (including circuit board assembly)
Highly scalable
Energy-saving
Modern, high-performance and efficient

Possible application areas

PC systems in production areas (24/7 suitable)
Compact workstation computer for offices (high multi-core performance, small dimensions, optional VESA mounting)
PC for trade and specialist dealers / POS (e.g. for cash register systems, service points, etc.)
Compact computer for treatment rooms in practices and hospitals
IoT Edge Node
Small server for companies, schools, educational institutions, authorities, ...
Thin Client / Lean Client
Network monitoring server
Dashboard display in production (production planning)
Production data acquisition / operating data acquisition / PDA terminal / process visualization
Building management computer / building automation computer / computer-aided facility management (CAFM)
Time recording system / personnel information system
Digital signage device


NEW: EM PRO midi® Cube - AMD Ryzen™ Embedded 8000 series

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AMD Ryzen™ EMBEDDED 8000 series

Up to 5.1 GHz | 8 cores, 16 threads | TDP max. 54 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded 8845HS, 8645HS, 8840U, 8640U
  • RDNA3 Radeon™ Graphics & XDNA Neural Processing Unit for AI Interferencing
  • Up to 2x 32 GB Dual Channel DDR5-RAM with ECC support
  • Gigabit-Ethernet: 2x Intel® I226-LM / 2.5 Gigabit with IEEE1588
  • WiFi (optional): 802.11 AX
  • SSD (optional): up to 2x M.2 NVMe
  • 2x USB 3.2 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 2x USB-C 3.2 Gen2 (10 Gb/s, OCP = 3000 mA each) or USB-C Alt Mode 
  • 2x RS-232/485 (HDX/FDX)
  • 2x Mini-DP++ ports, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)

EM PRO mini®

Size: only approx. 117 mm x 51 mm x 115 mm (width x height x depth)
Weight: approx. 700 g + options


up to 3.7 GHz | 4 cores, 8 threads | TDP max. 35 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V2516 and V2718
  • Integrated GPU: AMD Radeon™
  • Up to 2x 32 GB dual channel DDR4 memory
  • Gigabit Ethernet: 2x Intel® I225 2.5 Gigabit with IEEE1588
  • WiFi (optional): 802.11 AC with diversity
  • SSD (optional): M.2 SATA or up to 2x NVME / 64 GB - 512 GB
  • 1x dual USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB-C 3.1 Gen2 (10 Gb/s, OCP = 3000 mA) or USB-C Alt Mode
  • 2x RS-232/485 (HDX/FDX)
  • 2x Mini-DP++ ports, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)
     

up to 4.15 GHz | 4 cores, 8 threads | TDP max. 25 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded R2312 / R2314 / R2514 with Radeon™ Graphics
  • up to 2x 16 GB dual channel DDR4 memory with ECC support
  • Gigabit Ethernet: 2x Intel I225 with IEEE1588
  • WiFi (optional): 802.11 AC with diversity
  • SSD (optional): M.2 SATA or up to 2x NVMe / 64 GB - 512 GB
  • SD card: 1x MicroSD socket
  • 1x dual USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA)
  • 1x RS-232/485 (HDX/FDX), 1 RS-232(HDX/FDX)
  • 2x mini-DP++ connectors, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)

up to 3.8 GHz | 4 cores, 8 threads | TDP max. 35 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V1605B / V1807B and R1102G / R1305G / R1505G / R1606G
  • Integrated GPU: AMD Radeon™ Vega 3 (R1102G / R1305G / R1505G / R1606G); Vega 8 (V1605B); Vega 11 (V1807B) Graphics
  • Up to 2x 16 GB Dual Channel DDR4 memory (R1102 max. 16 GB Single Channel)
  • Gigabit Ethernet: 2x Intel I225 with IEEE1588
  • WiFi (optional): 802.11 AC with diversity
  • SSD (optional): M.2 SATA or up to 2x NVMe / 64 GB - 512 GB
  • SD card: 1x MicroSD socket
  • 1x dual USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA)
  • 1x RS-232 (HDX/FDX), 1 RS-232/485 (HDX/FDX)
  • 2x mini-DP++ connectors, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module

EM PRO midi®

Size: only approx. 111 mm x 201 mm x 117 mm (width x height x depth)
Weight: approx. 1,750 g + options


up to 4.9 GHz | 8 cores, 16 threads | TDP max. 45 W supported

Keyfeatures

  • CPU: AMD Ryzen™ PRO 6850U, 6650H, 6850H, 6950H
    with Radeon™ Graphics
  • Up to 2x 32 GB dual channel DDR5 memory with ECC support
  • Gigabit Ethernet: 2x Intel I226 / 2.5 Gigabit with IEEE1588
  • WiFi (optional): 802.11 AX
  • SSD (optional): M.2 SATA up to 2x NVMe, 2x 2.5" HDD/SSD expansion kit
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB 2.0 (480 Mb/s, OCP = 900 mA)
  • 2x USB-C 3.1 Gen2 (10 Gb/s, OCP = 300 mA) or USB-C Alt Mode
  • 2x RS-232/485 (HDX/FDX)
  • 2x Mini-DP++ connections, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)

up to 4.25 GHz | 8 cores, 16 threads | TDP max. 54 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V2546 (OEM only) and V2748, with Radeon™ Graphics
  • up to 2x 32 GB dual channel DDR4 memory
  • Gigabit Ethernet: 2x Intel® I225 Gigabit Ethernet with IEEE1588
  • WiFi (optional): 802.11 AC with diversity
  • SSD (optional): M.2 SATA up to 2x NVMe, 2x 2.5" HDD/SSD expansion kit
  • 1x dual USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB-C 3.1 Gen2 (10 Gb/s, OCP = 3000 mA) or USB-C Alt Mode
  • 1x USB 2.0 (480 Mb/s, OCP = 900 mA)
  • 2x RS-232/485 (HDX/FDX)
  • 2x Mini-DP++ ports, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)

up to 3.8 GHz | 4 cores, 8 threads | TDP max. 54 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V1807B
  • Integrated GPU: AMD Radeon™ Vega 11
  • Up to 2x 16 GB dual channel DDR4 memory with ECC support
  • Gigabit Ethernet: 2x Intel® I225 2.5 Gbit/s with IEEE1588
  • WiFi (optional): 802.11 AC with diversity
  • SSD M.2 (optional): up to 2x M.2 NVMe
  • SSD 2.5" slot: up to 2x SATA 2.5" SSDs/HDDs can be fitted
  • SD card: 1x MicroSD socket, V3.0 host controller up to 2.2 TB
  • 1x dual USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA)
  • 1x USB 3.2 Gen1 (5 Gb/s, OCP = 900 mA)
  • 2x RS-232/485 (HDX/FDX)
  • 2x Mini-DP++ connectors, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)