Our PROFIVE® brand single board computers are not only available in the OEM/ODM and easy to integrate versions, but also with integrated active or passive cooling solution (depending on the variant).

The advantage: These boards can be integrated and used immediately.


open-frame cooling solution

Size: only approx. 139 mm x 86 mm x 110 mm (width x height x depth)
Weight: approx. 890 g + options
A lid is available as an optional accessory.

active or passive cooling solution

Size: only approx. 113 mm x 46 mm x 109 mm (width x height x depth)
Weight: approx. 330 g + options

The ready to use variants are available with the following single boards:


open-frame cooling solution

up to 4.9 GHz | 8 cores, 16 threads | TDP max. 45W supported

Keyfeatures

  • CPU: AMD Ryzen™ PRO 6650H / 6850H / 6950H
  • powerful integrated GPU - AMD Radeon™ graphics
  • up to 2 32x GB dual channel DDR5 memory with ECC support
  • 2x Intel® I226 / 2.5 Gigabit Ethernet ports
  • TSN support / Wake-on-LAN supported by one port
  • 3x M.2 - Type B, Type E, Type M
  • 2x SATA (6G) with separate power connector
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP: 900 mA each)
  • 2x USB-C port 3.1 Gen2 (10 Gb/s, OCP: 1500 mA) or USB-C alt mode
  • 2x Mini-DP++ connectors, resolution up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)
     

up to 3.8 GHz | 4 cores, 8 threads | TDP max. 54 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V1807B
  • Integrated GPU: AMD Radeon™ Graphics
  • Up to 2x 16 GB dual channel DDR4 memory with ECC support
  • 2x Gigabit Ethernet ports Intel® I225 with IEEE1588
  • 1x MicroSD card slot
  • 3x M.2 - Type B, Type E, Type M (NVMe)
  • 2x SATA (6G) with separate power connector
  • Up to 4x USB 3.1 Gen1 (OCP = 900 mA each)
  • 2x Mini-DP++ connectors up to 4096 x 2160 @ 60 Hz
  • AMD® firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)

up to 4.25 GHz | 8 cores, 16 threads | TDP max. 54 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V2546 / V2748
  • integrated GPU: AMD Radeon™ graphics
  • Up to 2x 32 GB dual channel DDR4 memory
  • 2x Intel® I225 with IEEE1588 / 2.5 Gigabit Ethernet ports
  • TSN support / Wake-on-LAN supported by one port
  • 3x M.2 - Type B, Type E, Type M
  • 2x SATA (6G) with separate power connector
  • 1x Dual USB 3.1 Gen2 (10 Gb/s, OCP: 900 mA each)
  • 1x USB-C 3.1 Gen2 (10 Gb/s, OCP: 1500 mA)
  • 2x internal USB 2.0 (OCP: 900 mA each)
  • 2x Mini-DP++ connectors, resolution up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)


active or passive cooling solution

Aktive Kühlung

up to 4.7 GHz | 8 cores, 16 threads | TDP max. 28 W supported

Keyfeatures

  • CPU: AMD Ryzen™ PRO - 6650U / 6850U
  • Integrated GPU: AMD Radeon™ 660M
  • Max. 2x 32 GB dual channel DDR5 memory with ECC support
  • Gigabit Ethernet: 2x Intel® I226 2.5 Gigabit with IEEE1588
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP = 900 mA each)
  • 2x USB-C 3.1 Gen2 or ALT mode support (10 Gb/s, OCP = 1500 mA)
  • 2x RS-232/485 (HDX/FDX)
  • 2x mini-DP++ ports, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module, TPM 2.0 support (Infineon SLB 9670)
     

Aktive Kühlung


up to 3.5 GHz | Bis zu 4 cores, 4 threads | TDP max. 25 W supported
 

Keyfeatures

  • CPU: AMD Ryzen™ Embedded R2312G / R2314G
  • Integrated GPU: AMD Radeon™
  • Up to 2x 16 GB dual channel DDR4 memory
  • Gigabit Ethernet: 2 Intel® I226 2.5 Gigabit with IEEE1588
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP = 900 mA each)
  • 1x rear USB 3.1 Gen2 (10 Gb/s, OCP = 900 mA)
  • 1x internal USB 3.1 Gen2 (10 Gb/s, fused to = 900 mA)
  • 1x RS-232 (HDX/FDX) + 1 RS-232/485 (HDX/FDX)
  • 2x mini-DP++ connectors up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 Support (Infineon SLB 9670)



     
Downloads

data sheet on request


Aktive Kühlung

up to 3.8 GHz | 4 cores, 8 threads | TDP max. 35W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V1605B / V1807B and V1404I (extended temperature range)
  • Integrated GPU: AMD Radeon™ Vega Graphics
  • Up to 2x 16 GB dual channel DDR4 memory
  • Gigabit Ethernet: 2x Intel® I225/I226 with 2.5 Gbit/s with IEEE1588, TSN support, Wake-On-Lan supported by one port
    I225-LM: 0 °C to +60 °C ambient commercial temperature board variants
    I226-IT: -40 °C to +85 °C ambient industrial temperature board variants
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP = 900 mA each)
  • 1x Rear USB 3.1 Gen2 (10 Gb/s, OCP = 900 mA)
  • 1x RS-232 port (HDX/FDX) + 1 RS-232/485 port (FDX)
  • 2x Mini-DP++ connectors up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 Support (Infineon SLB 9670)
Aktive Kühlung

up to 4.15 GHz | 8 cores, 16 threads | TDP max. 25 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V2516 / V2718
  • Integrated GPU: AMD Radeon™
  • Up to 2x 32 GB dual channel DDR4 memory
  • Gigabit Ethernet: 2 Intel® I225 / 2.5 Gigabit
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP = 900 mA each)
  • 1x USB-C 3.1 Gen2 (10 Gb/s, OCP = 1500 mA)
  • 1x eDP port with max. 3840 x 2160 incl. backlight control (OEM/ODM option)
  • 2x Mini-DP++ sockets, resolution up to 4096 x 2160 @ 60 Hz
  • 2x RS-232/485 ports (HDX/FDX)
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 Support (Infineon SLB 9670)

Aktive Kühlung

Keyfeatures

  • CPU: Intel® Core™ 11th generation & Intel® Celeron® 6000 series / INTC6305E / I3-1115G4E / I5-1145G7E / I7-1185G7E / I3-1115GRE / I3-1145GRE / I7-1185GRE
  • Intel® UHD graphics for Intel® Core™ processors of the 11th generation up to Intel® Iris® Xᵉ graphics (depending on variant)
  • Up to 2x 32 GB dual channel DDR4-3200 SO-DIMM memory
  • Gigabit Ethernet: 2x Intel® I225/I226 with 2.5 Gbit/s with IEEE1588
    I225-LM: 0 °C to +60 °C ambient commercial temperature board variants
    I226-IT: -40 °C to +85 °C ambient industrial temperature board variants
  • TSN support, Wake-On-Lan supported by one port
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • Up to 2x USB 2.0 (internal) (480 mb/s, OCP = 900 mA each)
  • 1x USB-C 3.1 Gen2 (10 Gb/s, OCP = 3000 mA) or USB-C Alt Mode
  • 2x RS-232/485 ports (HDX/FDX)
  • 2x Mini-DP++ ports up to 4096 x 2160 @ 60 Hz
  • Intel® PTT (Firmware TPM) | TPM 2.0 support with Infineon SLB 9670

Passive KühlungAktive Kühlung

up to 3.5 GHz | 2 cores, 4 threads | TDP max. 25W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded processors
  • passive cooling solution: R1102G
  • active cooling solution: R1305G / R1505G / R1606G
  • integrated GPU: AMD Radeon™ Vega 3 graphics
  • up to 2x 16 GB dual channel DDR4 memory
  • 2x Gigabit Ethernet ports Intel® I210 with IEEE1588
  • TSN support, Wake-On-Lan supported by one port
  • 1x dual USB 3.1 Gen2 (10 Gb/s, OCP = 900 mA)
  • 1x rear USB 3.1 Gen2 (10 Gb/s, OCP = 900 mA)
  • 1x RS-232 port + 1 x RS-232/485 port (FDX)
  • 2x mini DP++ connector up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 Support (Infineon SLB 9670)

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