SBC PROFIVE® GS2
The PROFIVE® GS2 industrial single-board computer, developed and manufactured in Germany, is based on the AMD Ryzen™ embedded series. This board forms the basis for a wide range of applications and is available in the corresponding variants.
The GS2 board is available with the latest AMD R2000 CPU series with the "Zen+" x86 core architecture as well as AMD's V1000 and R1000 series.
With the temperature-optimized power supply from 12W to 54W, AMD Ryzen™ Embedded R2000 series SoCs provide thermal agility for compact systems to optimize design efficiency.
The powerful and optimized AMD Radeon™ high-performance integrated graphics unit provides optimal I/O connectivity for industrial and robotic systems, machine vision, IoT, thin clients and more.
Key features of the PROFIVE® GS2 include up to 9 USB ports, 2 10GBit SFP+ ports, up to 64 GB DualChannel DDR4 RAM, a wide range input from 10.8 VDC to 26.4 VDC and numerous other safety features. In addition to the "AMD Firmware Trusted Platform Module" and a TPM 2.0 chip (Infineon), these also include health monitoring and management with adjustable fan control, hardware monitoring and watchdog.
The availability of many different variants ensures that the optimum feature combination is always available for the respective application.
Versions for the extended, hardened temperature range of -40 °C to +85 °C are also available.
The SBC GS2 is ideal for applications that require high CPU and/or GPU performance as well as security features such as ECC & hardware TPM, for example security routers, VPN gateways, AI systems, medical applications, machine learning, computer vision, robotics, micro servers, high-performance workstations, robust industrial automation systems, IoT EDGE applications and much more.
Keyfeatures
- Powerful integrated GPU - AMD Radeon™ High-Performance graphic unit
- Up to 64GB DualChannel DDR4-RAM with ECC support
- Up to 3 Intel® I225 / 2.5 Gigabit Ethernet Ports
- TSN-Support / Wake-on-LAN supported by one port
- 4 M.2 - Type B, Type E, Type M, Type M
- 1 microSD XC Card Slot
- Up to 2 USB-A USB 3.2 Gen2 (10Gb/s, OCP = 900 mA each port)
- Up to 4 USB-A USB 3.2 Gen1 (5Gb/s, OCP = 900 mA each port)
- Up to 1 USB-A USB 2.0 (480Mb/s, OCP = 900 mA each port)
- 2 USB-C 3.2 Gen2 (10Gb/s, OCP = 3000 mA each port) or 2x USB-C Alt Mode (Resolution up to 4096 x 2160 @ 60 Hz)
- 2 Mini-DP++ Ports, resolution up to 4096x2160 @ 60Hz
- 1 RS-232
- fTPM - AMD firmware Trusted Platform Module | TPM 2.0 Support (Infineon SLB 9670) (depending on board variant)
- Min. 10,8 VDC to 26,4 VDC power input
- Max. commercial operating temperature from 0°C to + 60°C;
Max. industrial operating temperature from -40 °C to +85 °C - Max. storage temperature from -40°C to +85°C, non condensing
- Max. rel. humidity for storage: 95% @ 40°C, non condensing
- Max. rel. humidity for operation: 89% @ 40°C, non condensing
- Size approx.: 186 x 119 mm
Available CPUs, depending on board variant
Supported are different CPUs with a TDP of 8 W - 54 W1:
AMD Ryzen™ Embedded R2312
2 Kerne / 4 Threads | 2.7 GHz to 3.5 GHz | TDP: 12W to 25W
AMD Ryzen™ Embedded R2314
4 Kerne / 4 Threads | 2.1 GHz to 3.5 GHz | TDP: 12W to 25W
AMD Ryzen™ Embedded R2514
4 Kerne / 8 Threads | 2.1 GHz to 3.7 GHz | TDP: 12W to 35W
AMD Ryzen™ Embedded R2544
4 Kerne / 8 Threads | 3.35 GHz to 3.7 GHz | TDP:35W to 54W1
AMD Ryzen™ Embedded R1305G
2 Kerne / 4 Threads | 1.5 GHz to 2.8 GHz | TDP: 8W to 10W
AMD Radeon™ Vega 3 Graphics
AMD Ryzen™ Embedded R1505G
2 Kerne / 4 Threads | 2.4 GHz to 3.3 GHz | TDP: 12W to 25W
AMD Radeon™ Vega 3 Graphics
AMD Ryzen™ Embedded V1404I
4 Kerne / 8 Threads | 2.0 GHz to 3.6 GHz | TDP: 12W to 25W
AMD Radeon™ Vega 8 Graphics
AMD Ryzen™ Embedded V1605B
4 Kerne / 8 Threads | 2.0 GHz to 3.6 GHz | TDP: 12W to 25W
AMD Radeon™ Vega 8 Graphics
AMD Ryzen™ Embedded V1756B
4 Kerne / 8 Threads | 3.25 GHz to 3.6 GHz | TDP:35W to 54W1
AMD Radeon™ Vega 8 Graphics
AMD Ryzen™ Embedded V1807B
4 Kerne / 8 Threads | 3.35 GHz to 3.8 GHz | TDP:35W to 54W1
AMD Radeon™ Vega 11 Graphics
1 GS2 supports max. 45 W TDP