SBC PROFIVE® GS2

The PROFIVE® GS2 industrial single-board computer, developed and manufactured in Germany, is based on the AMD Ryzen™ embedded series. This board forms the basis for a wide range of applications and is available in the corresponding variants.

The GS2 board is available with the AMD R2000 CPU series with the "Zen+" x86 core architecture.

With the temperature-optimized power supply from 12 W to 54 W, AMD Ryzen™ Embedded R2000 series SoCs provide thermal agility for compact systems to optimize design efficiency.

The powerful and optimized AMD Radeon™ high-performance integrated graphics unit provides optimal I/O connectivity for industrial and robotic systems, machine vision, IoT, thin clients and more.

Key features of the PROFIVE® GS2 include up to 9 USB ports, 2 10GBit SFP+ ports, up to 64 GB DualChannel DDR4 RAM, a wide range input from 10.8 VDC to 26.4 VDC and numerous other safety features. In addition to the "AMD Firmware Trusted Platform Module" and a TPM 2.0 chip (Infineon), these also include health monitoring and management with adjustable fan control, hardware monitoring and watchdog.

The availability of many different variants ensures that the optimum feature combination is always available for the respective application.

Versions for the extended, hardened temperature range of -40 °C to +85 °C are also available.

The SBC GS2 is ideal for applications that require high CPU and/or GPU performance as well as security features such as ECC & hardware TPM, for example security routers, VPN gateways, AI systems, medical applications, machine learning, computer vision, robotics, micro servers, high-performance workstations, robust industrial automation systems, IoT EDGE applications and much more.

Keyfeatures

  • Powerful integrated GPU - AMD Radeon™ High-Performance graphic unit
  • Up to 64 GB DualChannel DDR4-RAM with ECC support
  • Up to 3 Intel® I225 / 2.5 Gigabit Ethernet Ports
  • TSN-Support / Wake-on-LAN supported by one port
  • 4 M.2 - Type B, Type E, Type M, Type M
  • 1 microSD XC Card Slot
  • Up to 2 USB-A USB 3.2 Gen2 (10Gb/s, OCP = 900 mA each port)
  • Up to 4 USB-A USB 3.2 Gen1 (5Gb/s, OCP = 900 mA each port)
  • Up to 1 USB-A USB 2.0 (480Mb/s, OCP = 900 mA each port)
  • 2 USB-C 3.2 Gen2 (10Gb/s, OCP = 3000 mA each port) or 2x USB-C Alt Mode (Resolution up to 4096 x 2160 @ 60 Hz)
  • 2 Mini-DP++ Ports, resolution up to 4096 x 2160 @ 60 Hz
  • 1 RS-232
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 Support (Infineon SLB 9670) (depending on board variant)
  • Min. 10,8 VDC to 26,4 VDC power input
  • Max. commercial operating temperature from 0°C to + 60°C;
    Max. industrial operating temperature from -40 °C to +85 °C
  • Max. storage temperature from -40°C to +85°C, non condensing
  • Max. rel. humidity for storage: 95% @ 40°C, non condensing
  • Max. rel. humidity for operation: 89% @ 40°C, non condensing
  • Size approx.: 186 x 119 mm

Available CPUs, depending on board variant

Supported are different CPUs with a TDP of 8 W - 54 W1:

AMD Ryzen™ Embedded R2312 
2 Kerne / 4 Threads | 2.7 GHz to 3.5 GHz | TDP: 12W to 25W

AMD Ryzen™ Embedded R2314 
4 Kerne / 4 Threads | 2.1 GHz to 3.5 GHz | TDP: 12W to 25W

AMD Ryzen™ Embedded R2514 
4 Kerne / 8 Threads | 2.1 GHz to 3.7 GHz | TDP: 12W to 35W

AMD Ryzen™ Embedded R2544 
4 Kerne / 8 Threads | 3.35 GHz to 3.7 GHz | TDP:35W to 54W1

 

1 GS2 supports max. 45 W TDP

Downloads