EM Box® - Industrial BoxPCs fanless

The industrial EM Box® PCs of the BSNP and BSIP series (waterproof version with protection class IP67) are characterised by passive cooling and very compact dimensions.

Based on our embedded NUC™ PROFIVE® single board computers, a wide range of performance levels is enabled, which means strong scalability, both in terms of performance and cost.

The advantages of silent & fanless passive cooling are clear:
The system is low-maintenance and is suitable for 24/7 operation due to the robust design as well as the high-quality built-in components. The compact dimensions allow the installation in numerous applications. Due to the closed design, the systems can be used in harsh environments.
Of course, the BoxPCs, like the single-board computers mentioned above, can be externally expanded by the industry-standard USB I/O modules.

Last but not least, the EM Box® PCs BSNP and BSIP are, like all our products - of course - Made in Germany.

The EM Box® PCs BSNP and BSIP currently support the installation of the following single board computers:

Other CPU models are available on request.

EM Box® PC fanless BSNP

Size: only approx. 130 mm x 56 mm x 119 mm (width x height x depth)
Weight: approx. 900 g + options
(image shows variant BSNP-NUCS)

EM Box® PC fanless with protection class IP67 BSIP

Size: only approx. 130 mm x 52 mm x 217 mm (width x height x depth)
Weight: approx. 1.480 g + options

AMD Ryzen™ PRO 6000 series - NUCS

up to 4.5 GHz | 6 cores, 12 threads | TDP max. 28 W supported

Keyfeatures

  • CPU: AMD Ryzen™ PRO 6650U and 6850U
  • Up to 2x 32 GB dual channel DDR5 memory with ECC support
  • Gigabit Ethernet: 2 Intel® I226 / 2.5 Gigabit with IEEE1588
  • 1x dual USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 2x USB-C 3.1 Gen2 (10 Gb/s, OCP = 3500 mA) or USB-C Alt Mode
  • 2x RS-232/485 (HDX/FDX)
  • DP connection: 2 mini DP++ connectors, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD Firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)

     
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Intel® Celeron® 6000 series, 11. Gen. Intel® Core™ i3, i5, i7 - NUCT

up to 4 cores, 8 threads | TDP max. 28 W supported

Keyfeatures

  • CPU: Intel® Core™ 11th generation & Intel® Celeron® 6000 series
  • Intel® UHD graphics for 11th generation Intel® Core™ processors up to Intel® Iris® Xᵉ graphics (depending on variant)
  • Up to 2x 32 GB dual channel DDR4-3200 SO-DIMM memory
  • Gigabit Ethernet: 2x Intel® I225/I226 with 2.5 Gbit/s with IEEE1588
    I225-LM: 0 °C to +60 °C ambient commercial temperature board variants
    I226-IT: -40 °C to +85 °C ambient industrial temperature board variants
  • TSN support, Wake-On-Lan supported by one port
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB-C 3.1 Gen2 (10 Gb/s, OCP = 3000 mA) or USB-C Alt Mode
  • 2x Mini-DP++ connector up to 4096 x 2160 @ 60 Hz
  • Intel® PTT (Firmware TPM) | TPM 2.0 Support (Infineon SLB 9670)
Downloads

AMD Ryzen™ Embedded R1000 series - NUCR

up to 3.3 GHz | 2 cores, 2 threads | TDP max. 25W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded R1102G / R1305/ R1505G
  • Bis zu 2x 16 GB dual channel DDR4 Speicher
  • Gigabit-Ethernet: 2x Intel® I225 2,5 Gbit/s mit IEEE1588
  • WiFi (optional): 802.11 AC mit Diversity
  • SSD (optional): M.2 SATA oder bis zu 2x NVMe / 64 GB - 512 GB
  • SD-Karte: 1 MicroSD Sockel
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP = je 1500 mA)
  • 1x USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA)
  • DP connector: 2x Mini-DP++ Anschlüsse, bis zu 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)
Downloads

AMD Ryzen™ Embedded V2000 series - NUCE

up to 3.95 GHz | 6 cores, 12 threads | TDP max. 25 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V2516 and V2718 with Radeon™ graphics
  • Max. 2x 32 GB dual channel DDR4-3200 memory
  • Gigabit Ethernet: 2x Intel I225 2.5Gbit/s with IEEE1588
  • WiFi (optional): 802.11 AC with diversity
  • SSD (optional): M.2 SATA or up to 2x NVMe / 64 GB - 512 GB
  • SD card: 1x MicroSD socket
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB-C 3.1 Gen2 (10 Gb/s, OCP = 3000 mA) or USB-C Alt Mode
  • DP connector: 2 Mini-DP++ connectors, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)
Downloads

AMD Ryzen™ Embedded R2000 series - NUCD

up to 3.5 GHz | up to 4 cores, 4 threads | TDP max. 25 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded R2312 / R2314 with Radeon™ Graphics
  • Up to 2x 16 GB dual channel DDR4 memory
  • Gigabit Ethernet: 2x Intel® I225 2.5 Gbit/s with IEEE1588
  • SD card: 1 MicroSD socket
  • 1x Dual USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA)
  • DP connector: 2x Mini-DP++ connectors, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)




     
Downloads