Our PROFIVE® brand single board computers are not only available in the OEM/ODM version and as a ready-to-use variant, but also including a mounted heatspreader. The "easy to integrate" versions have no fan or heat sink.

The advantage: The heatspreader, which also serves as a mounting plate, distributes the CPU heat to a larger cooling solution in the user's application. The mounting plate is compatible within the E.E.P.D. "easy to integrate" solutions, making it very easy to scale between performance classes. On the service side, this solution also brings great advantages, including fast replacement.

The easy to integrate variants are available with the following single boards:


up to 4.5 GHz | 6 cores, 12 threads | TDP max. 28 W supported

Keyfeatures

  • CPU: AMD Ryzen™ PRO - 6650U / 6850U / 6650H / 6850H / 6950H
  • integrated GPU: AMD Radeon™ 660M
  • max. 64 GB (Dual) Channel DDR5-4800 SO-DIMM memory with ECC support
  • Gigabit Ethernet: 2x Intel® I226-LM / 2.5 Gigabit
  • 2x USB 3.2 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 2x USB-C 3.2 Gen2 or ALT mode support (10 Gb/s, OCP = 3000 mA)
  • serial ports: 2x RS-232/485
  • DP connector: 2x Mini-DP++ connectors, up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module, TPM 2.0 support (Infineon SLB 9670)


up to 3.5 GHz | up to 4 cores, 4 threads | TDP max. 25 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded R2312 / R2314 / R2514 / R2544
  • integrated GPU: AMD Radeon™ graphics
  • max. 32 GB (dual) channel DDR4-3200 SO-DIMM memory
  • Gigabit Ethernet: 2x Intel® I225-LM / 2.5 Gigabit
  • 2x USB 3.2 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x rear USB 3.2 Gen2 (10 Gb/s, OCP = 1500 mA)
  • 1x internal USB 3.2 Gen1 (5 Gb/s, OCP = 900 mA)
  • 1x RS-232 port + 1 RS-232/485 port
  • 2x Mini-DP++ connector up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)


     

up to 3.8 GHz | 4 cores, 8 threads | TDP max. 35 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V1605B / V1807B and V1404I (extended temperature range)
  • Integrated GPU: AMD Radeon™ Vega 3 Graphics
  • Up to 2x 16 GB dual channel DDR4 memory
  • Gigabit Ethernet: 2 Intel® I225/I226 with 2.5 Gbit/s with IEEE1588, TSN support, Wake-On-Lan supported by one port
    I225-LM: 0°C to +60°C ambient commercial temperature board variants
    I226-IT: -40°C to +85°C ambient industrial temperature board variants
  • 1x dual USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA)
  • 1x RS-232 (HDX/FDX) + 1 x RS-232/485 (HDX/FDX)
  • 2x Mini-DP++ connectors up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module, TPM 2.0 support (Infineon SLB 9670)

up to 3.95 GHz | 6 cores, 12 threads | TDP max. 25 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V2516 / V2718 / V2546 / V2748
  • integrated GPU: AMD Radeon™ graphics
  • up to 2x 32 GB dual channel DDR4-3200 SO-DIMM memory
  • Gigabit Ethernet: 2x Intel® I225-LM / 2.5 Gigabit
  • 1x Dual USB 3.2 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB-C 3.2 Gen2 (10 Gb/s, OCP = 3000 mA)
  • 2x RS-232/485 ports (HDX/FDX)
  • 2x Mini-DP++ sockets, resolution up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)

up to 4 cores, 8 threads | TDP max. 28 W supported

Keyfeatures

  • CPU: Intel® Core™ 11th generation & Intel® Celeron® 6000 series / INTC6305E / I3-1115G4E / I5-1145G7E / I7-1185G7E / I3-1115GRE / I3-1115GRE / I7-1185GRE
  • Intel® UHD graphics for 11th generation Intel® Core™ processors up to Intel® Iris® Xᵉ graphics (depending on variant)
  • up to 64 GB (dual) channel DDR4-3200 SO-DIMM RAM memory
  • 2x Intel® I226 2,5 Gbit/s ports with IEEE1588
  • TSN support / Wake-on-LAN supported by one port
  • 2x USB 3.2 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1x USB-C 3.2 Gen2 (10 Gb/s, OCP = 3000 mA) or DP++ with resolution up to 4096 x 2160 @ 60 Hz
  • 2x internal USB 2.0 (480 Mb/s, OCP = 900 mA each)
  • 2x RS-232/485 port (HDX/FDX)
  • 2x mini-DP++ connector up to 4096x2160 @ 60Hz
  • TPM 2.0 support with Infineon SLB 9670

up to 3.5 GHz | 2 cores, 4 threads | TDP max. 25W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded R1102G / R1305G / R1505G
  • Integrated GPU: AMD Radeon™ Vega 3 Graphics
  • Up to 2x 16 GB dual channel DDR4 memory
  • 2 Gigabit Ethernet ports Intel® I225 2.5Gbit/s with IEEE1588
  • 1 Dual USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 1 Rear USB 3.1 Gen2 (10 Gb/s, OCP = 1500 mA)
  • 1 RS-232 (HDX/FDX) + 1 x RS-232/485 (HDX/FDX)
  • 2 Mini-DP++ connectors up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module, TPM 2.0 support (Infineon SLB 9670)

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