The industrial PROFIVE® Single Board Computer (SBC) NUCV was designed in the embedded NUC™ standard and is based on the latest AMD Ryzen™ Embedded V1000 platform which features excellent performance per watt as well as a superior integrated graphics unit.

Thus the NUCV SBC is a small (about 10 x 10 cm) and very powerful industrial embedded board, which is perfectly equipped for various applications like AI (artificial intelligence), ML (machine learning), CV (computer vision), Robotics as well as Mobile Systems, Automation, Measurement and IoT.

Different CPUs with a TDP of 12W - 54W¹ are used:

V1202B - 2 cores / 4 threads - 2.3 GHz to 3.2 GHz - TDP: 12W - 25W
AMD Radeon™ Vega 3 Graphics
(OEM/ODM version, on request)

V1605B - 4 cores / 8 threads - 2.0 GHz to 3.6 GHz - TDP: 12W - 25W
AMD Radeon™ Vega 8 Graphics

V1756B - 4 cores / 8 threads - 3.25 GHz to 3.6 GHz - TDP: 35W - 54W¹
AMD Radeon™ Vega 8 Graphics
(OEM/ODM version, on request)

V1807B - 4 cores / 8 threads - 3.35 GHz to 3.8 GHz - TDP: 35W - 54W¹
AMD Radeon™ Vega 11 Graphics

V1404I (embedded CPU with extended temperature range)
4 cores / 8 threads - 2.0 GHz to 3.6 GHz - TDP: 12W - 25W¹
AMD Radeon™ Vega 8 Graphics
Ambient temperature range: -40°C to +85°C
ATTENTION: This range is only fulfilled if RAM and SSD also meet this specification.

The NUCV SBC features a wide input voltage range from 8 VDC to 32 VDC as well as a special pre-fitting for vehicle use, including an input for continuous plus (terminal 30) and ignition plus (terminal 15). In addition, a special overvoltage protection circuit is implemented, which takes load-dump scenarios into account in particular.

Three different cooling profiles can be selected via bios settings:

• Silent Mode (office mode, recommended up to approx. 30°C ambient temperature)
• Optimized Cooling (default factory setting)
• Max Cooling

The TDP (12W to 25W) is also configurable via bios settings.

¹The NUCV supports only up to 35W TDP settings

The "easy to integrate" versions have no fan or heat sink.

The benefit: The heatspreader, which also serves as a mounting plate, distributes the CPU heat to a larger cooling solution in the user's application. The mounting plate is compatible within the E.E.P.D. "easy to integrate" solutions, making it very easy to scale between performance classes. On the service side, this solution also brings great advantages, including fast replacement.